Pay it Forward Scholarship

Women grads

The SNIPES Pay It Forward initiative is a nationwide campaign to support Historically Black Colleges and Universities (HBCUs). The initiative is part of SNIPES' commitment to giving back to the community and investing in the future of HBCUs and their graduates. Through this program, SNIPES aims to provide opportunities for underrepresented communities and empower the next generation of leaders by supporting education and creating a platform for important conversations. This Women’s History Month, SNIPES has selected three HBCUs to partner with for the Pay It Forward Initiative and provide (3) scholarships to students at each school, valued at $10,000 per award. The selected HBCUs include Coppin State University, Hampton University, and the University of the District of Columbia.

Selection Criteria

Applications are reviewed and scored by a Selection Committee of the Values Partnerships Team and SNIPES. The review committee will select individuals whom they believe are most likely to leverage this learning opportunity. They will seek female candidates who are eager to learn and plan to apply their skills and knowledge gained to benefit their academic careers, their universities, and their communities.  All decisions are final.

Grant Distribution

If you are selected to receive a Pay It Forward Scholarship, a member of the Selection Committee will work with the recipient(s) to collect financial account details and disburse funding.


To be eligible for an award, applicants must be:

  • Female
  • A current student at Coppin State University, Hampton University, or theUniversity of the District of Columbia
  • Enrolled in at least 12 credit hours
  • GPA of at least 2.5

How to Apply

Complete application form consisting of:

  • Complete the application form consisting of:
    • Contact & demographic information
    • Short essay questions about your career and learning objectives
  • Submit application on or before the deadlines
  • Contact with any questions about the application


Application Submission Date: March 20th to April 19th, 2024 11:59 PM EST